Cinterion EGS3 Quad-band LGA module

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Cinterion EGS3 Quad-band LGA module
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Product description

Cinterion’s Evolution Platform is comprised of multiple Cinterion modules offering scalability, compatibility as well as an easy path to future upgrades and added functionality as technology needs expand. Portfolio benefits include maximum flexibility, high functionality, ease of integration, as well as backward and forward compatibility, which ensures a reliable, high quality and cost efficient solution that preserves your technology investment.

Part of the Evolution Platform, the LGA solderable products including the EES3 modules which feature efficient and  reliable LGA mounting technology along with optimized size and performance. The modules are based on a new advanced processor design and the field proven and reliable Cinterion M2M software stack. The latest chip technology enables high performance, improved efficiency and the benefit of long-term availability.

The EGS3 Wireless Module — Offers enhanced M2M connectivity with GPRS Class 12 functionality, an integrated TCP/IP stack over AT as well as industrial interfaces SPI, I²C, and USB port.


Technical specifications

General features

  • Control via AT commands
    (Hayes 3GPP TS 27.007 and 27.005)
  • GPRS multi-slot Class 12
  • Circuit Switched Data Up to 14.4kbps
  • SMS & Fax
  • SIM Application Toolkit (release 99)
  • TCP/IP stack access via AT commands
    Internet services: TCP, UDP, HTTP, FTP, SMTP, POP3
  • Supply voltage range: 3.2 … 4.5 V
  • Operational temperature range: -40°C to +85°C
    switch off: > +85°C
  • Dimensions: 33.9 x 29.6 x 3.2 mm
  • Weight: 5.5 g

Specification for GPRS Data transmission

  • GPRS Class 12 & Class 10
    Max. 86 kbps DL & UL
  • Coding schemes CS 1-4

Specification for voice

  • Triple-rate codec for HR, FR, and EFR
  • Adaptive multi-rate AMR
  • Hands-free operation, Echo cancellation & Noise reduction

Special features

  • Character framing 7E1 and 8E1 at serial interface
  • SIM Access Profile integrated
  • RLS Monitoring
  • Advanced Temperature Management

Interfaces (LGA pads)

  • Antenna 50 Ω solder pad
  • Audio: 2 x analog, 1 x digital
  • 2x Serial interface (ITU-T V.24 protocol)
  • SIM card interface 3V, 1.8V
  • USB 2.0 full speed
  • I²C & SPI bus


  • Local approvals and network operator certifications
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